Please use this identifier to cite or link to this item: http://10.1.7.192:80/jspui/handle/123456789/10352
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dc.contributor.authorPatel, Shubham H.-
dc.date.accessioned2021-12-31T05:03:00Z-
dc.date.available2021-12-31T05:03:00Z-
dc.date.issued2020-07-05-
dc.identifier.urihttp://10.1.7.192:80/jspui/handle/123456789/10352-
dc.descriptionSubmitted to: Prof. Tejas Modien_US
dc.description.abstractJPMorgan Chase & Co. is a leading global financial services firm with assets of $2.69 trillion and operations in more than 100 countries. The firm is a leader in investment banking, financial services for consumers and small business, commercial banking, financial transaction processing, asset management and private equity. A component of the Dow Jones Industrial Average, JPMorgan Chase & Co. serves millions of consumers in United States and many of the world’s prominent corporate, institutional and government clients under its J.P. Morgan and Chase brands. The project is a result of the work done for JPMorgan Chase & Co. from April to June 2020 for a period of 9 weeks. The objective of the project was to understand and evaluate the electronics signatures model involving the process flow involved, an intensive industrial analysis of the competitors of the e-signatures industry and generating a cost benefit model analysis to showcase what features are been provided by the top market leaders and the annual prices they charge. It also involved formulating a relative digital strategy for easing the documentation process to overcome the unprecedented times like the covid-19 impact and any such unforeseen situations in the future.en_US
dc.description.sponsorshipInstitute of Management, NUen_US
dc.language.isoen_USen_US
dc.publisherInstitute of Management, NUen_US
dc.relation.ispartofseries191350;-
dc.subjectSummer Internship Projecten_US
dc.subjectSummer Projecten_US
dc.subjectInternship Project Reporten_US
dc.subjectMBA Project Reporten_US
dc.subjectDissertation, IMen_US
dc.subjectDissertation, MBAen_US
dc.subjectMBA – FT (2019-2021)en_US
dc.subjectSummer Project Report 2019en_US
dc.titleElectronics Signatures Researchen_US
dc.title.alternativeJPMorgan Chase & Co.en_US
dc.typeDissertationen_US
Appears in Collections:MBA - Summer Internship Report

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