Post-Silicon Characterization on WLAN SoC for IEEE 802.11AC/AX Chipsets

Abstract

IEEE 802.11 has formed a task group to investigate and develop next-generation WLAN solutions for dense deployments that include a significant number of access points and stations. IEEE 802.11ax amendment completes this proposal. WLAN stands for Wireless Local Area Network and is widely used in a variety of applications. A Transceiver Architecture is developed in a Semiconductor Chip to make this Technology a reality over the air. On the PHY and MAC layers, significant changes are made. Modulation Technique, Coding Rate, and other factors determine the PHY layer. The major characteristics of the IEEE 802.11AX WLAN standard are OFDMA and MU-MIMO in the uplink. This new change should also be backwards compatible with existing standards. The PHY layer frame format has been modified for interoperability. The IEEE 802.11AX WLAN standard activity (on the PHY layer) is detailed in this paper, which includes substantial changes and validation of the IEEE 802.11AX amendment's most significant characteristics. Because the Physical layer (PHY) and the MAC layer are two separate sorts of layers, it's important to double-check any additional PHY alterations. In this thesis we focus on validating IEEE 802.11 AC/AX performance characteristics like RF parameters such as Error Vector Magnitude (EVM), Spectral flatness, In-phase/quadrature (I/Q) Imbalance, Spectral Mask, Rate V/s Range(RVR) and Current Consumption and we will observe how the IEEE 802.11AX has improved the reliability and efficiency compare to IEEE 802.11AC standard.