Improve the Thermal Consistency of the MCCB

Abstract

This study aims to improve the thermal stability of the Go-Pact series MCCB. The main objective is to improve thermal stability and add circuit breakers to increase competitiveness and meet customer requirements. The present invention relates to calibrating a thermal trip device for a circuit breaker that uses a bimetallic element to break the circuit when a set temperature is reached. FEA is a powerful method for optimizing the design of electrical devices. We propose using ANSYS FEM to support the design and modeling of modular low voltage circuit breakers. A thermal simulation of a miniature circuit breaker (MCB) model was performed using acquired and laboratory data. The simulation approach is reflected in the experimental results. The modeled elements exhibited similar physical properties and failure when tested under specific conditions consistent with experimental conditions. 3D models can analyze the thermal behavior of electrical current flow at the indel level in electrical engineering. Please shorten the length of this text.