Please use this identifier to cite or link to this item: http://10.1.7.192:80/jspui/handle/123456789/6129
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dc.contributor.authorPatel, Nirav Dilipkumar-
dc.date.accessioned2015-09-11T06:49:49Z-
dc.date.available2015-09-11T06:49:49Z-
dc.date.issued2015-06-01-
dc.identifier.urihttp://hdl.handle.net/123456789/6129-
dc.description.abstractQuality is very essential part of any organization. This thesis discusses the quality improvement in MCCB manufacturing industry using six sigma methodology. Six sigma DMAIC approach (Define, Measure, Analysis, Improve, Control) is used for problem solving. Different quality tools like, Pareto analysis, cause & effect analysis, why why analysis and brain-storming are used for finding the root causes of the defects. Objective of this project was to identify the root cause and improve First Time Yield (FTY) in MCCB. To achieved objective six sigma methodology adopted and step by step phase was followed. During investigation root cause of defect was found and action plan prepared for reduction of the defect. After implementation, defects were reduced and Quality was improved in MCCB. Mini tab software was used for statistical analysis. Design of Experiment is used to improve quality and reduce defect in under voltage accessories of MCCB. Experiments are carried out by using Shainin Methodology to identified root cause of the defect at assembly level and improve the First Time Yield (FTY). After implementation of Shainin Methodology, root cause were found and Improvement was observed in quality of under voltage accessories and under voltage accessories Yield was improved by 40%.en_US
dc.publisherInstitute of Technologyen_US
dc.relation.ispartofseries13MMCM15;-
dc.subjectMechanical 2013en_US
dc.subjectProject Reporten_US
dc.subjectProject Report 2013en_US
dc.subjectMechanical Project Reporten_US
dc.subject13MMCMen_US
dc.subject13MMCM15en_US
dc.subjectCIMen_US
dc.subjectCIM 2013en_US
dc.titleQuality Improvement in MCCBen_US
dc.typeDissertationen_US
Appears in Collections:Dissertation, ME (CIM)

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