Development of Modular Firmware Support Package BIOS for Next Generation Processors

Abstract

This topic mainly presents a discussion about the Firmware Support Package BIOS. In broader view Firmware Support Package Basic Input Output System is the bi- nary distribution of necessary Intel Silicon initialization code which provide access to programming information which is not publicly available .The research work mainly described in the thesis is mainly focused on improving the performance of BIOS and exibility to the users to use any open source boot loaders. Basically the BIOS in modern PC share to initialize and test the system hardware components, and to load a boot loader or an operating system from amass memory device which is used for silicon initialization. It is act as layer between OS and hardware to initialize the system as well as for booting system after that control give to OS and BIOS. It played supporting hardware role for the devices. The FSP provides chipset and processor initialization in a format that can easily be incorporated in to many ex- isting boot loaders. The rst design goal of FSP is to provide access to the key programming information that is open source .These cond design goal is to abstract the complexities of Intel Silicon initialization and expose a limited number of well de ned interfaces .A fundamental design philosophy is to provide the ubiquitously required silicon initialization code. The next generation processors for FSP used to give better performance to the customers are Kabylake, Broxton and Apollolake which will release in 2016.Mainly Kabylake and Apollolake are for PCs and Broxton is for tablet.So by using FSP for next generation processors, Intel gives best answer for that clients who need to utilize open source boot loaders for particular BIOS.