RF Characterization Of Massive Silicon Via Automation

Abstract

The motivation of this project comes from increasing demands of wireless devices in the market. All of those devices also compatible with the older technology as well as new technology. As demand increases more complicated design need to develop to fulfill the high-speed data requirement of users. These things forms that every design should verify before it goes to consumer end. If we think about Wi-Fi, it is very big area to explore. There are different types of standards, which have its own specifications; IEEE gives these specifications. RF Characterization is a major part for design of Wi-Fi/BT chip; it also includes different tests cases. All the test cases are further group in two major parts: RF test cases and throughput test cases. In RF, tests like Transmit power control (TPC), Error Vector Magnitude (EVM), PER test etc. In throughput test, it is like to measure throughput of various channel at various rate. In addition, these all testes are perform automatically over thousands of parts using robotic automation (Chroma 3111). Later all the data can be automatically log into system and can further be use for the data analysis of individual part or for multiple parts according to requirement.