Studies on multi branch heat pipe

Abstract

With the fast improvement of microelectronics and the data business, different electronic gadgets have created from the viewpoints of miniaturization and high performance. The chips of electronics produce a high amount of heat, because of this life of electronics parts and capacity are truly reducing in this condition. Heat removal is a tough challenge that has to be solved rapidly. Now a days, heat pipes are generally used for removal of heat for single heat sources, where one heat source related to only one heat sink. With constant advancement in integration and miniaturization, heat source numbers increase inside electronics circuits and systems. Because of this, there is sharp increase in heat load, and convectional heat pipe is not useful for solving problem of multi-heat loads. In present study, a T shaped multi branch heat pipe (MBHP) is proposed with two evaporator and one condenser-connected by liquid and vapour lines. The setupwas developed for studying the effect of different heat load on both evaporators, thermal resistance analysis, start-up characteristics, temperature distributions and heat transfer coefficients of wicked and wickless heat pipe. Experiments are conducted in thermosyphon mode for 60% filling ratio in wickless and different filling ratios for wicked heat pipe. By experimental study, it has been observed that: (1) Start-up time is less than 15 min for total heat load (different loads on both evaporators) of 100 W and start-up time is less than 14 min for heat load of 90 W (different loads on both evaporators). (2) Load distribution on both the evaporators are different but the maximum temperature that the multi branch thermosyphon attains is nearly equal for all load combinations. (3) Minimum thermal resistance is 0.34 °C/W for 100 W and for both evaporator maximum temperature is below 90 °C. (4) Maximum heat transfer coefficient is 387 W / m2 K. (4) Vacuum level plays a key role in MBHP.