Please use this identifier to cite or link to this item: http://10.1.7.192:80/jspui/handle/123456789/10352
Title: Electronics Signatures Research
Other Titles: JPMorgan Chase & Co.
Authors: Patel, Shubham H.
Keywords: Summer Internship Project
Summer Project
Internship Project Report
MBA Project Report
Dissertation, IM
Dissertation, MBA
MBA – FT (2019-2021)
Summer Project Report 2019
Issue Date: 5-Jul-2020
Publisher: Institute of Management, NU
Series/Report no.: 191350;
Abstract: JPMorgan Chase & Co. is a leading global financial services firm with assets of $2.69 trillion and operations in more than 100 countries. The firm is a leader in investment banking, financial services for consumers and small business, commercial banking, financial transaction processing, asset management and private equity. A component of the Dow Jones Industrial Average, JPMorgan Chase & Co. serves millions of consumers in United States and many of the world’s prominent corporate, institutional and government clients under its J.P. Morgan and Chase brands. The project is a result of the work done for JPMorgan Chase & Co. from April to June 2020 for a period of 9 weeks. The objective of the project was to understand and evaluate the electronics signatures model involving the process flow involved, an intensive industrial analysis of the competitors of the e-signatures industry and generating a cost benefit model analysis to showcase what features are been provided by the top market leaders and the annual prices they charge. It also involved formulating a relative digital strategy for easing the documentation process to overcome the unprecedented times like the covid-19 impact and any such unforeseen situations in the future.
Description: Submitted to: Prof. Tejas Modi
URI: http://10.1.7.192:80/jspui/handle/123456789/10352
Appears in Collections:MBA - Summer Internship Report

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