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http://10.1.7.192:80/jspui/handle/123456789/10352
Title: | Electronics Signatures Research |
Other Titles: | JPMorgan Chase & Co. |
Authors: | Patel, Shubham H. |
Keywords: | Summer Internship Project Summer Project Internship Project Report MBA Project Report Dissertation, IM Dissertation, MBA MBA – FT (2019-2021) Summer Project Report 2019 |
Issue Date: | 5-Jul-2020 |
Publisher: | Institute of Management, NU |
Series/Report no.: | 191350; |
Abstract: | JPMorgan Chase & Co. is a leading global financial services firm with assets of $2.69 trillion and operations in more than 100 countries. The firm is a leader in investment banking, financial services for consumers and small business, commercial banking, financial transaction processing, asset management and private equity. A component of the Dow Jones Industrial Average, JPMorgan Chase & Co. serves millions of consumers in United States and many of the world’s prominent corporate, institutional and government clients under its J.P. Morgan and Chase brands. The project is a result of the work done for JPMorgan Chase & Co. from April to June 2020 for a period of 9 weeks. The objective of the project was to understand and evaluate the electronics signatures model involving the process flow involved, an intensive industrial analysis of the competitors of the e-signatures industry and generating a cost benefit model analysis to showcase what features are been provided by the top market leaders and the annual prices they charge. It also involved formulating a relative digital strategy for easing the documentation process to overcome the unprecedented times like the covid-19 impact and any such unforeseen situations in the future. |
Description: | Submitted to: Prof. Tejas Modi |
URI: | http://10.1.7.192:80/jspui/handle/123456789/10352 |
Appears in Collections: | MBA - Summer Internship Report |
Files in This Item:
File | Description | Size | Format | |
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191350_Shubham Patel_Prof. Tejas Modi.pdf | 191350 | 1.08 MB | Adobe PDF | ![]() View/Open |
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