Simulation and Modification of Microwave Package for Space Communication Payload

Abstract

The purpose of a microwave package is to integrate all the components of a sub-system in such a way to minimize size, mass, complexity and cost. It should provide electrical interfaces between the components in the spacecraft system and ensure high reliability. The packaging of integrated circuits for satellites is a challenging task, as the package has to withstand space environment. The design of a microwave package must integrate the skills of electrical, mechanical, manufacturing, industrial, material and systems engineers. This paper thoroughly reviews the mechanical design of channel amplifier tray for GEOSAT communication payloads. The entire tray with machining and assembly aspects has been simulated using 3D CAD model. The assembly has been modified for mass reduction using structural analysis meeting all electro-mechanical constraints. The tray has been reviewed for Design or Manufacturing and Assembly (DFM & A). The CAD model has been analyzed using Altair HyperMesh software for modal as well as linear static analysis. The theoretical analysis results and effect of mass reduction on geometrical tolerance of the tray have been verified by fabrication of the simulated tray hardware and by carrying out vibration testing. The results obtained will be useful for future design of space microwave payload subsystems.