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  4. Faculty Paper, ME
Please use this identifier to cite or link to this item: http://10.1.7.192:80/jspui/handle/123456789/4440
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dc.contributor.authorPatel, Dhaval V.-
dc.contributor.authorDev, Rahul-
dc.contributor.authorIyer, V. R.-
dc.contributor.authorSrinivas, A. R.-
dc.date.accessioned2014-01-28T08:10:08Z-
dc.date.available2014-01-28T08:10:08Z-
dc.date.issued2010-06-
dc.identifier.urihttp://10.1.7.181:1900/jspui/123456789/4440-
dc.descriptionJournal of Mechanical Engineering, Vol. 8 (1), June, 2010, Page No. 26 - 32en_US
dc.description.abstractElectronic devices used in space craft are characterized by few combination of different materials joined together with the help ofen_US
dc.publisherSpace Society of Mechanical Engineers, Space Application Centre (SAC) ISRO, Ahmedabaden_US
dc.relation.ispartofseriesITFME034-2en_US
dc.subjectMechanical Faculty Paperen_US
dc.subjectFaculty Paperen_US
dc.subjectITFME034en_US
dc.subjectIDPRI001-
dc.titleImprovized Thermo Structural Stress Relief Techniques For Micro Integrated Circuit (MIC) Carriersen_US
dc.typeFaculty Papersen_US
Appears in Collections:Faculty Paper, ME

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