IR @ Nirma University
Keeping in tune the global developments we are creating an institutional repository using DSpace Software (Digital Library Software). We are archiving institutional knowledge like, faculty papers, theses, and dissertations in PDF format at DSpace. Students can access this digital information anywhere in the campus.
Please use this identifier to cite or link to this item:
http://10.1.7.192:80/jspui/handle/123456789/4440| Title: | Improvized Thermo Structural Stress Relief Techniques For Micro Integrated Circuit (MIC) Carriers |
| Authors: | Patel, Dhaval V. Dev, Rahul Iyer, V. R. Srinivas, A. R. |
| Keywords: | Mechanical Faculty Paper Faculty Paper ITFME034 IDPRI001 |
| Issue Date: | Jun-2010 |
| Publisher: | Space Society of Mechanical Engineers, Space Application Centre (SAC) ISRO, Ahmedabad |
| Series/Report no.: | ITFME034-2 |
| Abstract: | Electronic devices used in space craft are characterized by few combination of different materials joined together with the help of |
| Description: | Journal of Mechanical Engineering, Vol. 8 (1), June, 2010, Page No. 26 - 32 |
| URI: | http://10.1.7.181:1900/jspui/123456789/4440 |
| Appears in Collections: | Faculty Paper, ME |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| ITFME034-2.pdf | ITFME034-2 | 772.51 kB | Adobe PDF |  View/Open |
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